Moving a flexible PCB from prototype to mass production is not a simple matter of increasing quantity. While the circuit design may remain unchanged, the manufacturing approach, process controls, and risk factors evolve significantly as volumes scale up. Understanding these changes early helps avoid cost overruns, yield loss, and unexpected delays. This article explains what truly changes in flexible PCB manufacturing when transitioning from prototype builds to full-scale pr

In double-sided flexible printed circuit manufacturing, copper foil surface cleaning is a critical pretreatment step performed before photoresist coating. At Flex Plus, this process is based on long-term production experience in flexible and rigid-flex PCB manufacturing and is strictly controlled to support stable mass production of fine-line flexible PCB products. Although surface cleaning may appear to be a simple operation, it requires special attention in flexible PCB fab

In flexible PCB and rigid-flex PCB manufacturing, via filling and via plugging are critical processes used to improve soldering reliability, prevent contamination, and meet high-density assembly requirements. Compared to rigid PCBs, flexible PCBs use polyimide substrates, which makes via filling more challenging and requires stricter process control. Let's now explore common via filling and plugging methods for flexible PCBs, their applications, and key manufacturing consider

Electromagnetic interference (EMI) has become a familiar challenge in flexible PCB design—especially as devices get thinner, faster, and more compact. There’s no single “best” way to block EMI, but several practical shielding approaches have proven reliable across consumer electronics, automotive, medical, and aerospace applications. Among all available choices, three EMI shielding methods stand out as the most widely used and most flexible-friendly:copper layers, shielding f

In the flexible PCB manufacturing process, the black hole process is a crucial step that improves interlayer conductivity and overall product reliability. From a manufacturer’s perspective, this method replaces traditional electroless copper deposition with a cleaner and more stable carbon-based treatment, making it ideal for modern flexible PCB production. What Is the Black Hole Process? The black hole process is a non-metallic conductive hole pretreatment used to create a t

In flexible PCB manufacturing, The function of adhesive is to bond together all the layers of the circuit board. The main types of flexible PCB adhesive are epoxy, acrylic, thermoplastic PI, pressure-sensitive adhesive, and conductive adhesive. Different adhesives are applied in different processes. They all have their own unique characteristics. 1. Lamination Adhesive Lamination adhesives can bond the copper foil to the polyimide film or join multiple flexible printed circui

The main chemicals used in flexible PCB etching are ferric chloride (FeCl₃), cupric chloride (CuCl₂), hydrochloric acid (HCl) for acid...

Why Biocompatibility Matters for Flex PCBs In medical and wearable electronics, the role of Flex PCBs goes beyond conducting...

As technology trends move toward miniaturization and higher performance, COB on flexible PCB is becoming a critical solution for modern electronics. This technique allows bare chips to be mounted directly onto flexible substrates, enabling space-saving, lightweight, and high-speed designs. At Flex Plus, we specialize in flex PCB manufacturing and offer COB services, enabling us to help customers bring advanced electronic designs to life quickly and efficiently. What Is COB on

PCB designers often rely on common "standards" when working with flex PCB, leaning toward certain thicknesses that balance cost and...